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hlmp-adxx/agxx/alxx/bdxx/bgxx/blxx 5mm mini oval precision optical performance alingap lamps data sheet features ? f well fdefnedf spatialf radiationf pattern ? f viewing fangles:f f major faxisf70 f minor faxisf35 ? f high fluminousfoutput ? f red fandf amberf intensityf aref availablef for: f alingap f (bright)fffffffffffffffffffffffffffffffffffffffffffffffffffffffffffffffffffffffffff f alingapfiif (brightest) ? f colors: f 626fnmf red f 630fnmf red f 590fnmfamber f 592fnmfamber ? f superior f resistancef tof moisture ? f uv f resistantf epoxy applications ? f full f color/videof signs description these f precision f opticalf performance f oval f ledsf are f spe - cifcallyf designed f for f fullf color/video f andf passengerf infor - mation f signs. f the f oval f shapedf radiation f pattern f (35f xf 70)f andf highf luminousf intensity f ensure f that f thesef devices f are f excellent f for f widef feldf off viewf outdoor f application f where f af widef viewingf anglef andf readability f inf sunlight f are f essential. f these f lampsf have f very f smooth,f matched f radiation f patterns f ensuring f consistent f color f mixingf inf fullf color f applications, f messagef uniformity f across f thef viewingf anglefoffthef sign. high f efciency f ledf material f isf usedf inf thesef lamps:f aluminum f indium f gallium f phosphide f (alingap) f for f amberf andf red. f eachf lampf isf madef withf anf advance f opticalf grade f epoxy f ofering f superior f highf temperature f andf highf moisture f resistance f inf outdoor f applications. f the f package f epoxy f contains f both ff uv-a f andf uv-b f inhibitors f to f reduce f thef efectsfofflongf termf exposuref tof directf sunlight. designers f canf select f parallel f orf perpendicular f orientation. f both flampsf aref availablefinf tintedf version. benefts ? f viewing f anglef designed f for f widef feldf off viewf application ? f superior f performancefinf outdoorf environments
2 table 1. device selection guide for alingap ii part number color and dominant wavelength l d (nm) typ. luminous intensity iv (mcd) at 20 ma min. luminous intensity iv (mcd) at 20 ma max. stand-of leadframe orientation package drawing hlmp-ad06-nstxx red f630 680 2500 no parallel a hlmp-ad06-p00xx red f630 880 no parallel a hlmp-ad06-p0txx red f630 880 no parallel a hlmp-ad06-pq0xx red f630 880 1500 no parallel a hlmp-ad06-rstxx red f630 1500 2500 no parallel a hlmp-ad06-sttxx red f630 1900 3200 no parallel a hlmp-ad16-p00xx red f630 880 yes parallel b HLMP-AD16-QTTXX red f630 1150 3200 yes parallel b hlmp-ad16-rs0xx red f630 1500 2500 yes parallel b hlmp-ad16-rstxx red f630 1500 2500 yes parallel b hlmp-ad16-rutxx red f630 1500 4200 yes parallel b hlmp-ad16-st0xx red f630 1900 3200 yes parallel b hlmp-ad16-sttxx red f630 1900 3200 yes parallel b hlmp-al16-rsrxx amber f592 1500 2500 yes parallel b hlmp-al16-rskxx amber f592 1500 2500 yes parallel b hlmp-bd06-l00xx red f630 400 no perpendicular c hlmp-bd06-p00xx red f630 880 no perpendicular c hlmp-bd06-rs0xx red f630 1500 2500 no perpendicular c hlmp-bd06-rstxx red f630 1500 2500 no perpendicular c hlmp-bd06-sttxx red f630 1900 3200 no perpendicular c hlmp-bd16-np0xx red f630 680 1150 yes perpendicular d hlmp-bd16-qrtxx red f630 1150 1900 yes perpendicular d hlmp-bd16-ru0xx red f630 1500 4200 yes perpendicular d hlmp-bd16-rutxx red f630 1500 4200 yes perpendicular d hlmp-bd16-st0xx red f630 1900 3200 yes perpendicular d hlmp-bd16-sttxx red f630 1900 3200 yes perpendicular d hlmp-bl06-n00xx amber f592 680 no perpendicular c
3 table 2. device selection guide for alingap part number color and dominant wavelength l d (nm) typ. luminous intensity iv (mcd) at 20 ma min. luminous intensity iv (mcd) at 20 ma max. stand-of leadframe orientation package drawing hlmp-ag01-k00xx red f626 310 no parallel a hlmp-al01-l00xx amber f590 400 no parallel a hlmp-al01-lp0xx amber f590 400 1150 no parallel a hlmp-al01-n00xx amber f590 680 no parallel a hlmp-al01-nr0xx amber f590 680 1900 no parallel a hlmp-al01-pqkxx amber f590 880 1150 no parallel a hlmp-al11-nr0xx amber f590 880 1900 yes parallel b hlmp-bg01-lm0xx red f626 400 520 no perpendicular c hlmp-bg01-mn0xx red f626 520 680 no perpendicular c hlmp-bl01-nr0xx red f626 680 1900 no perpendicular c hlmp-bl11-kn0xx red f626 310 880 yes perpendicular d hlmp-bl11-nr0xx red f626 680 1900 yes perpendicular d
4 part numbering system hlmpf-f x f x f x f x f-f x f x f x f xx mechanical options 00:fbulkf packaging dd:f ammof pack yy: f flexi-bin;fbulkf packaging zz:f flexi-bin;f ammof pack color bin 0:fnof colorfbinf limitation b:f colorfbinf2fandf3fonly k: f colorfbinsf2fandf4fonly r:f colorfbinsf1,f2,f4,fandf6fwithf vffmaxfoff2.6f v s:f colorfbinsf2fandf4fwithf vffmaxfoff2.6f v t: f redf colorfwithf v f fmaxfoff2.6f v maximum intensity bin 0:fnof ivfbinf limitation minimum intensity bin tint option 1forf6:f matchingf colorf tints standof option 0:f without 1:f with color d:f630fnmf red g:f626fnmf red l:f590forf592fnmf amber package a:f5fmmf minif oval,f parallel b:f5fmmf minif oval,f perpendicular note: f pleasef referf tofabf5337f forf completef informationfonf partf numberingf system.
5 package dimensions 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 1.50 0.15 (0.059 0.006) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 1.50 0.15 (0.059 0.006) hlmp-alxx pkg dimensions a b c d 11.70 + 0.13 ? 0.08 0.461 + 0.005 ? 0.003 ) ( notes: 1. all dimensions are in millimeters (inches). 2. tapers shown at top of leads (bottom of lamp package) indicate an epoxy meniscus that may extend about 1 mm (0.040 in.) down the leads. 3. recommended pc board hole diameters: C lamp packages a and c without stand-offs: flush mounting at base of lamp package = 1.143/1.067 mm (0.044/0.042 in.). C lamp packages b and d with stand-offs: mounting at lead stand-offs.
6 absolute maximum ratings at t a = 25?c parameter red and amber dcf forwardf current [1] f 50fma peak f pulsedf forwardf current [2] f 100 fma average f forwardf currentf 30fma reverse f voltage f(i r f=f100f a)f 5f v power f dissipationf 120fmw ledf junctionf temperaturef 130c operating f temperature f rangef C40cf tof+100c storage f temperature f rangef C40cf tof+100c notes: ff 1.f derate f linearlyfasf shownfinf fguref4.fff 2.f duty f factorf30%,f frequencyf 1khz. electrical/optical characteristics at t a = 25c parameter symbol min. typ. max. units test conditions typical f viewing f angle f f majorf 2 q 1/2 f f 70f f deg f f minorf f f 35 forward f voltagef v f f f f f vf i f f=f20fma f f red f( l d f=f626fnm)f f f 2.0f 2.4f f f f red f( l d f=f630fnm)f f f f f f f f f f f f option fxx0xxf f f 2.2f 2.4f f f f f f f f option f xxtxxf f f 2.3f 2.6f f f f f f f amber f( l d f=f590f nm)f f f 2.0f 2.4f f f f f f f amber f( l d f=f592f nm)f f f f f f f f f f f f option fxx0xxf f f 2.2f 2.4f f f f f f f f option fxxrxx,f xxsxxf f f 2.3f 2.6 reverse f voltagef f f f f f f f amber, f redf v r f 5f 20f f vf i r f=f100f a peak f wavelengthf f f f f f peak foff wavelength fof f f amber f( l d f=f592fnm)f l peak f f 594f f nmf spectral f distribution f f red f( l d f=f630fnm)f f f 639f f f at fi f f=f20fma spectral fhalfwidthf f f f f f wavelength f width f at f f amber f( l d f=f592fnm)f ?l 1/2 f f 17f f nmf spectral f distributionf1/2 f f red f( l d f=f630fnm)f f f 17f f f power f pointf atffi f f=f20fma capacitancef f f f f f v f f=f0,fff=f1f mhz f f amber, f redf cf f 40f f pf luminous f efcacyf f f f f f emitted f luminous f f amber f( l d f=f592fnm)f h v f f 500f f lm/wf power/emitted f radiant f f red f( l d f=f630fnm)f f f 155f f f power f atfi f f=f20fma thermal f resistancef r q j-pin f f 240f f c/wf led f junction-to- f f f f f f f f f cathode f lead notes: 1.f 2 q 1/2 fisfthefof-axisfanglef wherefthefluminousf intensityfisf1/2fthefon-axisf intensity. 2.f the f radiant f intensity, f i e f inf watts f perf steradian, f may f bef found f from f thef equation f i e f =f i v / h v f where f i v f isf thef luminousf intensity f inf candelasf andf h v f is f fthefluminousf efcacyfinf lumens/watt. 3.f the fluminousf intensityfisf measuredfonfthefmechanicalfaxisfofftheflampf package. 4.f the fopticalfaxisfisfcloselyf alignedfwithfthef packagefmechanicalf axis. 5.f the f dominantf wavelength,f l d ,fisf derivedf fromfthefcief chromaticityf diagramfandf representsfthef colorfoffthef lamp. 6.f for foptionsf-xxrxx,f-xxsxxfandf -xxtxx,fmax.f forwardf voltagef (vf )fisf2.6f v. f referf tof vffbinf table.
7 figure 1. relative intensity vs. wavelength. figure 2a. amber, red forward current vs. forward voltage. figure 2b. forward current vs. forward voltage for option -xxtxx red, and option -xxrxx and -xxsxx amber. figure 4. amber, red maximum forward current vs. ambient temperature. figure 3. amber, red relative luminous intensity vs. forward current. 0 70 60 40 20 current ? ma v f ? forward voltage ? v 1.0 3.0 amber hlmp-alxx fig 3 1.5 2.0 2.5 10 30 50 red 0 40 20 dc forward current ? ma forward voltage ? v 0 3.0 1.0 1.5 2.5 10 30 50 0.5 2.0 amber red relative intensity (normalized at 20 ma ) 0 0 forward current ? ma 20 30 2.0 1.0 50 0.5 1.5 2.5 10 40 amber red hlmp-alxx fig 7 i f ? forward current ? ma 0 0 t a ? ambient temperature ? c 40 80 50 40 30 20 10 20 60 100 r ja = 585 c/w r ja = 780 c/w 0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 5 0 0 5 5 0 6 0 0 6 5 0 7 0 0 w a v e l e n g t h - n m r e l a t i v e i n t e n s i t y r e d a m b e r
8 figure 5. spatial radiation pattern C 35 x 70 degree lamps. vf bin table [2,3] bin id min. max. vaf 2.0f 2.2 vbf 2.2f 2.4 vcf 2.4f 2.6 notes: 1.f all f binf categories f are f establishedf for f classifcation f off products. f products f may f notf bef available f inf allf binf categories. f please f contact f your f avagof representativef forf furtherf information. 2.f vf f binf tablef onlyf available f for f thosef numbersf withf optionsf -xxrxx,f -xxsxx,f -xxtxx. 3.f tolerance f forfeachfbinflimitfisff0.05v hlmp-alxx fig 8a relative intensity ? % 100 0 vertical angular displacement ? degrees 80 60 50 70 20 50 10 30 40 40 0 20 -10 -30 -50 90 30 10 -20 -40 hlmp-alxx fig 8b relative intensity ? % 100 0 horizontal angular displacement ? degrees 80 60 50 70 20 50 10 30 40 40 0 20 -10 -30 -50 90 30 10 -20 -40 intensity bin limits (mcd at 20 ma) bin name min. max. kf 310f 400 lf 400f 520 mf 520f 680 nf 680f 880 pf 880f 1150 qf 1150f 1500 rf 1500f 1900 sf 1900f 2500 tf 2500f 3200 uf 3200f 4200 tolerance f forfeachfbinflimitfisf15%. amber color bin limits (nm at 20 ma) bin name min. max. 1f 584.5f 587.0 2f 587.0f 589.5 4f 589.5f 592.0 6f 592.0f 594.5 tolerance f forfeachfbinflimitfisff0.5fnm.
9 precautions: lead forming: ? f the f leadsf off anf ledf lampf may f bef preformed f orf cutf to f lengthf priorf tof insertionfandf solderingfonfpcf board. ? f for f better f control, f itf isf recommended f to f usef proper f tool f to f precisely f form f andf cutf thef leadsf to f applicablef lengthf ratherfthanfdoingfitf manually. ? f if f manualf leadf cuttingf isf necessary, f cutf thef leadsf after f thef soldering f process. f the f solderf connection f forms f af mechanicalf ground f whichf prevents f mechanicalf stress f duef to f leadf cuttingf from f traveling f into f ledf package. f this f isf highlyf recommended f for f handf solderf operation, f asfthef excessfleadflengthfalsof actsfasfsmallf heatf sink. soldering and handling: ? f care f mustf bef takenf during f pcbf assemblyf andf soldering f process f tof preventfdamagef tofthefledf component.f ? f led f component f may f bef efectively f handf soldered f to f pcb. f however, f itf isf onlyf recommended f underf unavoidable f circumstances f suchf asf rework. f the f closestf manualf soldering f distance f off thef soldering f heat f source f (soldering f irons f tip) f to f thef bodyf isf 1.59mm.f soldering f thef ledf usingf soldering f iron f tipf closerf thanf 1.59mmf might fdamagefthef led. note: f 1.f pcb f withf diferent f size f andf design f (component f density) f willf have f diferent f heat f massf (heat f capacity). f this f might f causef af changef inf temperature f experienced f by f thef board f iff samef wave f soldering f settingf isf used. f so, f itf isf recommended f to f re-calibrate f thef soldering f profle fagainf beforefloadingfafnewf typefoff pcb. 2.f avago f technologies f highf brightness f ledf are f usingf highf efciency f ledf dief withf singlef wire f bondf asf shown f below. f customer f isf advisedf to f takef extra f precaution f during f wave f soldering f to f ensure f that f thef maximumf wave f temperature f doesf notf exceed f 250cf andf thef solderf contact f timef doesf notf exceeding f 3sec. f over-stressing f thef ledf during f soldering f process f might f causef premature f failure f to f thef ledf duef to f delamination. avago technologies led confguration 1.59mm ? f esd f precaution f mustf bef properly f appliedf onf thef soldering f station f andf personnelf to f prevent f esdf damagef to f thef ledf component f that f isf esdf sensitive. f do f refer f to f avago f application f note f anf 1142f for f details. f the f soldering f iron f usedf shouldf have f grounded f tipf to f ensure f electrostaticf chargefisf properlyf grounded. ? f recommended f solderingf condition: wave soldering [1, 2] manual solder dipping pre-heat f temperature 105fcf max. - preheat ftime 60fsecf max - peak f temperature 250fcf max. 260fcf max. dwell ftime 3fsecf max. 5fsecf max note: f 1)f above f conditions f refers f to f measurement f withf thermocouple f mounted f atfthef bottomfoff pcb. 2)f it f isf recommended f to f usef onlyf bottom f preheaters f inf order f to f reduce f thermal f stressf experiencedf byf led. ? f wave f soldering f parameters f mustf bef setf andf maintained f according f to f thef recommended f temperature f andf dwell f time. f customer f isf advisedf to f perform f dailyf checkf onf thef soldering f profle f to f ensure f that f itf isf always f conforming f to f recommendedf solderingf conditions. f note: f electrical f connection f between f bottom f surface f off ledf dief andf thefleadf framefisf achievedf throughf conductivef paste. ? f any f alignment f fxture f that f isf beingf appliedf during f wave f soldering f shouldf bef looselyf ftted f andf shouldf notf applyf weight f orf force f onf led. f nonf metalf material f isf recommended f asf itf willf absorb f lessf heat f during f wave f soldering f process. ? f at f elevated f temperature, f ledf isf more f susceptible f to f mechanicalf stress. f therefore, f pcbf mustf allowed f to f cool f down f to f room f temperature f prior f to f handling, f whichf includesf removalfoff alignmentf fxtureforf pallet. ? f if f pcbf board f contains f bothf through f holef (th) f ledf andf otherf surface f mount f components, f itf isf recommended f that f surface f mount f components f bef soldered f onf thef top f sidef off thef pcb. f if f surface f mount f needf to f bef onf thef bottom f side, f thesef components f shouldf bef soldered f usingf refowf solderingf priorf tof insertionfthef thf led. ? f recommended f pcf board f plated f through f holesf (pth)f size f forfledf componentf leads. led component lead size diagonal plated through hole diameter 0.45fxf0.45fmm (0.018xf0.018finch) 0.636fmm (0.025finch) 0.98f tof1.08fmm (0.039f tof0.043finch) 0.50fxf0.50fmm (0.020xf0.020finch) 0.707fmm (0.028finch) 1.05f tof1.15fmm (0.041f tof0.045finch) ? f over-sizing f thef pthf canf leadf to f twisted f ledf after f clinching. f onf thef otherf handf underf sizingf thef pthf canf causef difcultyf insertingfthef thf led. allngap device cathode
10 example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. refer f to f application f note f an5334f for f more f information f aboutf soldering f andf handlingf off highf brightness f thf ledf lamps. ammo packs drawing note: the f ammo-packsf drawingfisfapplicablef forf packagingfoptionfCddf&fCzzfandf regardlessfoffstandofforf non-standof.
11 packaging label (i)f avago f motherflabel:f (availablefonf packagingf boxfoffammofpackfandfshippingf box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l packaging box for ammo packs note: for f inganf device,fthefammofpackf packagingf boxf containsfesdf logo. f r o m l e f t s i d e o f b o x , a d h e s i v e t a p e m u s t b e f a c i n g u p w a r d . a v a g o t e c h n o l o g i e s a n o d e m o t h e r l a b e l c a t h o d e c a + ? a n o d e l e a d l e a v e s t h e b o x f i r s t . l a b e l o n t h i s s i d e o f b o x .
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5989-1903en av02-1542en - september 16, 2008 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with acronyms and defnition: bin:f (i)f color fbinfonlyforf vffbinfonly f (applicable f for f part f numberf withf color f binsf butf withoutf vff binf orf part f numberf withf vff binsf andf nof color fbin) orfffffffff (ii)fcolor fbinf incorporatedfwithf vffbin f (applicable f for f part f numberf that f have f bothf color f binf andf vffbin) (ii)favago f babyflabelf (onlyf availablefonfbulkf packaging) example: (i)f color fbinfonlyforf vffbinfonly f bin: f2f (representf colorfbinf2fonly) f bin: f vbf (representf vffbinf vb fonly) (ii)fcolor fbinf incorporatefwithf vffbin f bin: f2vbff f f vb:f vffbinf vb f f 2:ff colorfbinf2fonly ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l

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